Stable 8 Zones Lead Free Reflow Oven Equipment, SMD Reflow Oven for Assembly
The Parameter Date of Reflow Oven RF-800I
| 8 Zones Reflow Oven | RF-800I |
| Length of Heating Zones | 2950 MM |
| No. of Heating Zones | Top 8 & Bottom 8 |
| Dimension | 5000*1300*1450mm ( L*W*H ) |
| Max. Width of PCB | 50 ~ 400 MM |
| Convryor Speed | 20-2000 MM/min |
| Mesh Width | 450 MM |
| Normal Operation Power | About 9KW |
| PCB Conveyor Method | Mesh and Rails |
| No. of Cooling Zones | 2 |
| Nozzle Plate | Stainless Steel Plate |
| Temp. Setting Range | ~320C |
| Power Supply | 380V 50HZ / 220V 60HZ |
| Temperature Control Precision | ± 1C |
Features of 8 Zones Reflow Oven
1, Fully meet various requirements for lead free SMT process especially BGA, CSP packaging.
2, User-friendly interface, Windows operation system with English version
3, PLC+PID Close loop control mode to get reliable temperature control and stable profiles
4, Independent and high efficient air management system for 8
couples of top/bottom zones to make the production more flexibly and effectively.
5, Tailor -made rails with special treatment to avoid the bending and deforming
6, Standard with protection function after power off which shall ensure the PCB come out from chamber without damage or heating impact< Powerful software can monitor the temperature at real time and take the profile on line, at same time to analysis, save or print out the profiles.
7, Unique air management system with multi-layer of thermal insulation chamber to obtain the lowest power consumption.
Option of Reflow Oven
1. Double conveyor system the inphase parallel double conveyor of chains and mesh, the width of the conducting racks can be adjusted individually.
2. Centering support system.
Picture Showing of Reflow Oven
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8 Zones Lead Free SMD Reflow Soldering Equipment Images
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